Powder Coating Troubleshooting Guide
Chapter Eleven: Powder Curing Process
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 Baking Needs for Powder Coatings 
Thermoplastic Powders: 
 Thermoset Powders: 
 Although the bake/cure process generally follows after the coating is applied, there are instances when it’s preferable to heat the substrate first. 
  | 
 Factors Affecting Cure 
  
Recommended cure times are based on time at METAL TEMPERATURE.  | 
Stages of Cure Development
Melt point:
- Powder particles begin changing from a solid to semi-liquid state.
 
Flow stage:
- Powder is fully liquefied, reaching lowest viscosity, allowing film to smooth out
 
Cross linking stage:
- Sufficient, sustained heat triggers large scale reaction within film, initial steps to total chemical/physical change of product
 
Gel stage:
- When sufficient crosslinking has occurred, for solidification of the film from a liquid to a solid
 
Cure development:
- The final, and most critical stage when baking results in reaction of majority of crosslinking sites and development of full design properties
 
Typical Cure Development
| % Cure Properties | ![]()  | 
| Cure Time (minutes) | 
Importance of Metal Thickness
| Metal Temperature (°F) | ![]()  | 
| Oven Time (minutes) | 
Bake Oven Designs and Energy Consumption
  | 
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IR Curing Sources
 Different wave lengths have different curing properties to be considered. 
  | 
The Frequency Spectrum
 
 
The Frequency Spectrum
 
 
Optimum Infrared Wave Lengths
 
Other Chapters
- Early Powder Coatings, Uses, and Types
 - Manufacturing of Powder Coatings
 - Powder Chemistries, Formulations, Comparisons, and Uses
 - Comparisons to Liquid Coatings
 - Measuring Up the Product
 - Pretreatment
 - Powder Application Methods and Equipment
 - Powder Coating Recovery Equipment
 - The Electrostatic Charge Process
 - Powder Application Tips
 - Safety Issues With Powder Coatings
 - TCI Troubleshooting Guide
 - Glossary of Industry Related Terms
 


